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ap65251 document number: ds36109 rev. 1 - 2 1 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 2a, 16v, 500khz acot synchronous dc/dc buck converter description the ap65 251 is an adaptive constant on -time mode synchronous buck converter providing high efficiency, excellent transient response and high dc output accuracy for low-voltage regulation in digita l tv s, set-top-boxes, and network systems. the constant- on -time control scheme handles wide input/output voltage ratios and provides low external component count. the internal proprietary circuit enables the device to adopt ultr a-low esr ceramic capacitors. the adaptive on-time control supports seamless transition between continuous conduction mode (ccm) at higher load conditions a nd discontinuous conduction mode (dcm) at lighter load condition s. dcm allows ap65 251 to maintain high efficiency at light load conditions. the ap65 251 also features uvlo, otp , and ocp to protect the circuit. this ic is available in tsot2 6 package. features ? v in 4. 5v to 16v ? 2a continuous output current, 2.5 a valley ? efficiency up to 95% ? automated light load improvement ? v out adjustable to 0.6 to 6v ? 500khz switching frequency ? internal soft-start ? enable pin ? over current protection (ocp) with hiccup ? thermal protection ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. green device (note 3) pin assignments tsot26 top view 3 2 1 6 4 5 bst gnd fb sw vin en applications ? gaming consoles ? flat screen tv sets and monitors ? set top boxes ? distributed power systems ? home audio ? consumer electronics ? network systems ? fpga, dsp and asic supplies ? green electronics note s: 1 . no purposely added lead. fully eu directive 2002/95/ec (rohs) & 2011 /65/eu (rohs 2) compliant. 2. see http://www.diodes.com for more information about diodes incorporateds definitions of hal ogen- and antimony-free, "green" and lead-free. 3. halogen- and antimony- free "green products are defined as those which contain <900ppm bro mine, < 900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. typical applications circuit ap65251 l1 2.2 h r1 10k r2 10k c5 100n f c2 22 f c1 10 f 5 in 4 en 6 sw 1 bst 3 fb 2 gnd output v out 1.2v cff intput figure 1. typical application circuit figure 2. load transient 0 to 2a
ap65251 document number: ds36109 rev. 1 - 2 2 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 pin descriptions pin name pin number function tsot26 bs t 1 high-side gate drive boost input. bst supplies the drive for the high-side n-channel mosfet a 0.01 f or greater capacitor from sw to bst to power the high side switch. gnd 2 power g round . fb 3 feedback sensing terminal for the output voltage . connect this pin to the resistive divider of the output. s ee setting the output voltage. en 4 enable input. en is a digital input that turns the regulator on or off. drive en high to turn on the regulator; low to turn it off. attach to in with a 100k? pull up resisto r for automatic startup. vin 5 power input. vin supplies the power to the ic, as well as the step-do wn converter switches. drive vin with a 4.5v to 16v power source. bypass vin to gnd with a suitably large capacitor to eliminate noise on the input to the ic. see input capacitor. sw 6 power switching output. sw is the switching node that suppli es power to the output. connect the output lc filter from sw to the output load. note that a capacitor is required from sw to bst to power the high-side switch. functional block diagram 5 vin 4 en 6 sw 3 fb 2 gnd internal reference - + + digital control logic 1 bst ref 5v ss ocp soft start min off time s r q + se on time compute vin q one shot sw frequency lock loop 0.6v vcc regulator ss sw uvlo logic control 5v figure 2 . functional block diagram
ap65251 document number: ds36109 rev. 1 - 2 3 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 absolute maximum ratings (note 4) (@t a = +25c, unless otherwise specified.) symbol parameter rating unit v in supply voltage -0.3 to 20 v v sw switch node voltage -1.0 to v in +0.3 v v bst bootstrap voltage v sw -0.3 to v sw +6 .0 v v fb feedback voltage -0.3v to +6 .0 v v en enable/uvlo voltage -0.3v to +16 .0 v t st storage temperature -65 to +150 c t j junction temperature +160 c t l lead temperature +260 c esd susceptibility (note 5) hbm human body mode 2000 v cdm charge device model 10 00 v notes: 4 . stresses greater than the 'absolute maximum ratings' specified above m ay cause permanent damage to the device. these are stress ratings on ly; functional operation of the device at these or any other conditions e xceeding those indicated in this specification is not implied. device reliability may be affected by exposure to absolute maximum rating conditions for ext ended periods of time. 5 . semiconductor devices are esd sensitive and may be damaged by exposure to esd events. suitable esd precautions should be take n when handling and transporting these devices. thermal resistance (note 6) symbol parameter rating unit ja junction to ambient tsot26 122 c/w jc junction to case tsot26 28 c/w note: 6. test condition for sot26: device mounted on fr-4 substrate, sing le-layer pc board, 2oz copper, with minimum recommended pad layou t recommended operating conditions (note 7) (@t a = +25c, unless otherwise specified.) symbol parameter min max unit v in supply voltage 4.5 16 v t a operating ambient temperature range - 40 +85 c note: 7. the device function is not guaranteed outside of the recommend ed operating conditions.
ap65251 document number: ds36109 rev. 1 - 2 4 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 electrical characteristics (@ t a = +25c, v in = 12v, unless otherwise specified.) symbol parameter test conditions min typ max unit i shdn shutdown supply current v en = 0v 0.1 1 .0 a i q supply current (quiescent) v en = 2.0v, v fb = 1.0v 0. 8 ma r ds(on)1 high-side switch on-resistance (note 8) 150 m r ds(on)2 low -side switch on-resistance (note 8) 90 m i valley_limit ls valley current limit (note 8) t a = -40c to +85c 1.9 2.5 3 a f sw oscillator frequency 500 khz d max maximum duty cycle 75 % t on minimum on time 130 ns v fb feedback voltage t a = -40c to +85c, ccm 591 6 00 609 mv v en_h en logic high 1. 8 v v en_l en logic low 0.4 v i en en input current v en = 2v 6 a v en = 0v 0 a uvlo v in under voltage threshold rising t a = -40c to +85c 3.55 3.9 4. 25 v v in under voltage threshold hysteresis 300 mv t ss soft-start period 0.8 ms t sd thermal shutdown (note 8) 150 c thermal hysteresis (note 8) 20 c note: 8 . compliance to the datasheet limits is assured by one or more methods: prod uction test, characterization, and/or design.
ap65251 document number: ds36109 rev. 1 - 2 5 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 typical performance characteristics (@ t a = +25c, v in = 12v, v out = 1.2v, unless otherwise specified.) 85?c - 40?c 25?c 85?c 25?c - 40?c v in =4.5v v in =16v v in =12v io=2a io=0ma io=10ma
ap65251 document number: ds36109 rev. 1 - 2 6 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 typical performance characteristics (cont.) (@t a = +25c, v in = 12v, v out = 1.2v, unless otherwise specified.) v o =5.0v v o =3.3v v o =2.5v v o =1.2v vin=4.5v vin=12v vin=16v v in =4.5v v in =16v v in =12v
ap65251 document number: ds36109 rev. 1 - 2 7 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 typical performance characteristics (cont.) (@t a = +25c, v in = 12v, v out = 1.2v, l = 2.2h, c1 = 10f, c2 = 22 f, unless otherwise specified.) startup through v en 0a load time-500s/div startup through v en 2a load time-5 00 s/div startup through v in 2a load time-5 00 s/div shutdown through v en 0a load time-20 0m s/div shutdown through v en 2a load time-20s/div shutdown through v in 2a load time-100s/div short circuit test time- 1m s/div short circuit recovery time-1ms/div startup through v in 0a load time-500s/div load transient response (0 to 2a ) time- 10 0s/div load transient response (0 to 1a) time-100s/div shutdown through v in 0a load time-2 00 ms/div load transient response (1 to 2a) time- 10 0s/div switching state 2a load time-1s/div switching state 1a load time-1s/div vout_ac (20mv/div ) vsw ( 10 v/div ) il (2a/div ) ven (5v/div ) vout (500mv/div ) il ( 2a /div ) vsw (1 0v /div ) v en (5 v/div ) vsw (10v/div ) il (500ma/div ) vout (500mv/div ) ve n (5 v/div ) vout (500mv/div ) il (500ma/div ) vsw (1 0v /div ) v en (5v/div ) vout (500mv/div ) il ( 2a /div ) vsw (1 0v /div ) vin (5v/div ) vout (500mv/div ) il ( 2a /div ) vsw (1 0v /div ) vin (5v/div ) vout (500mv/div ) il ( 2a /div ) vsw (1 0v /div ) vout_ac (100mv/div ) iout (1a/div ) vout (500mv/div ) il ( 2a /div ) vin (5v/div ) vout (500mv/div ) il (500ma/div ) vsw (1 0v /div ) vin (5v/div ) vout (500mv/div ) il (500ma/div ) vsw (1 0v /div ) vout (500mv/div ) il ( 2a /div ) vin_ac (200mv/div ) vout_ac (20mv/div ) vin_ac (100mv/div ) vsw ( 10 v/div ) il (2a/div ) vout_ac (100mv/div ) iout ( 1a /div ) vout_ac (50mv/div ) iout ( 1a /div )
ap65251 document number: ds36109 rev. 1 - 2 8 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 application information ap65251 l1 2.2 h r1 10k r2 10k c3 100n f c2 22 f c1 10 f 5 in 4 en 6 sw 1 bst 3 fb 2 gnd output v out 1.2v c5 input figure 3. typical application of ap65251 pwm operation and adaptive on-time control the ap6 5251 is a synchronous step-down converter with internal powe r mosfets. adaptive constant on time (acot) control is employed to provide fast transient response and easy loop stabilization. at the beginning of each cycle, the high-side mosfet is turned on for a fixed one shot timer, on-time period . this one shot is calculated by the converter s input voltage (v in ) and the output voltage (v out ) cycle- by -cycle based to maintain a pseudo-fixed frequency over the input voltage ra nge, hence it is called adaptive on-time control. the high-side mosfet turned off after the fixed on time expire and turn on the low-side mosfet. once the output voltage dropped below the output regulation, t he low-side turned off. the one-shot timer then reset and the high-side mosfet is turne d on again. ap65 251 uses an adaptive on-time control scheme and does not hav e a dedicated in board oscillator. it runs with a ps eudo -constant frequency of 650khz by using the input voltage and output voltage to s et the on-time one-shot timer. the on-time is inversely proportional to the input voltage and proportional to the output voltage. it can be calc ulated using the following equation: f v ? ? in v out on t v out is the output voltage v in is the input voltage f is the switching frequency after an on-time period, the ap65251 goes into the off-tim e period. the off-time period length depends on vfb in most case . it will end when th e fb voltage decreases below 0. 6v , then the on-time period is triggered. if the off-time pe riod is less than the minimum off time, the minimum off time will be applied, which is about 260ns typica l. power save mode the ap6 5251 is designed with power save mode (psm) at light load con ditions for high efficiency. the ap65 251 automatically reduces the switching frequency and changes the ton time to tmin-on tim e during a light load condition to get high efficiency and low o utput ripple . as the output current decreases form heavy load condition, the inductor current decreases as well, eventually its valley comes close to zero current, which is the boundary between ccm and dcm. the low side mosfe t is turned off when the inductor current reaches zero level. the load is provided only by output capacitor, when fb voltage is lower than 0.6v, the next on cycle begins. the on-time is the mi nimum on time that benefits for decreasing v out ripple at light load condition. when the output current increases from light to heavy load the switching frequency inc reases to keep output voltage. the transition point to light load operation can be calculated using the following equation: on t v ? ? ? 2l out in v load i t on is on-time
ap65251 document number: ds36109 rev. 1 - 2 9 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 application information (cont.) enable above the en high - level input voltage, the internal regulator is turned on and the quiescent current can be measured above this threshold. the enable (en) input allows the user to control turning on or off the regulator. to enable the ap65 251 , en must be pulled above the en high -level input voltage . t o disable the ap65 251 , en must be pulled below en low - level input voltage. in figure 3, en is a high voltage input that can be safely connected to v in (up to 16v) directly or through a 100k ? pull -up to v in for automatic start- up. over current protection (ocp) figure 4 shows the over current protection (ocp) scheme o f ap65351. in each switching cycle, the inductor current is sensed by monitoring the low-side mosfet during the off period. when the voltage between gnd pin and sw pin is lower than the over current trip leve l, v limit , the ocp will be triggered and the controller keeps the off state. a new switching cycle will beg in when the measured voltage is higher than limit voltage. after 6s, the internal ocl (over current logic) thresho ld is set to a lower level and internal ss is discharged such that output is 0v . then the switching action is blanked out for 0.6ms before soft star t re-initiated and ocp threshold is restored to higher value. oc comparator v limit q1 q2 s q r figure 4 overcurrent protection scheme under voltage lockout undervoltage lockout is implemented to prevent the ic fr om insufficient input voltages . the ap65251 has a uvlo comparator that monitors the input voltage and the internal bandgap reference. if the input voltage falls below 3.9v, the ap65251 will disable. in this event, both high-side and low-side mosfets are turned off. thermal shutdown if the junction temperature of the device reaches the th ermal shutdown limit of 150c, the ap65 251 shuts itself off, and both hmos and lmos will be turned off. the output is discharged with the internal tr ansistor. when the junction cools to the required level (130c n ominal), the device initiates soft-start as during a normal power-up cycle. power derating characteristics to prevent the regulator from exceeding the maximum junction tempera ture, some thermal analysis is required. the temperature ris e is given by: ? ? ja pd ? ? ? rise t where pd is the power dissipated by the regulator and ? ja is the thermal resistance from the junction of the die to the ambient temperature. the junction temperature, t j , is given by: rise a t t ? ? j t t a is the ambient temperature of the environment. for tsot26 p ackage, the ? ja is 70 ? c/w. the actual junction temperature should not exceed the absolute maximum junction temperature of 125 ? c when considering the thermal design. the plot below is a ty pical derating curve versus ambient temperature. figure 5 output current derating curve vs temperature vout=5v vout=3.3v vout=2.5v vout=1.2v
ap65251 document number: ds36109 rev. 1 - 2 10 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 application information (cont.) setting the output voltage the output voltage can be adjusted from 0.6v using an external resistor divider. an optional c5, in figure 3, of 10pf to 47pf used to improve the transient response. resistor r1 is selected based on a design tradeoff between efficiency and output voltage a ccuracy. table 2 shows a list of resistor selection for common output voltages. for high values o f r1 there is less current consumption in the feedback ne twork . r1 can be determined by the following equation: ?? ? ?? ? ? ? ? 1 0.6 v r r out 2 1 output voltage (v) cout (uf) l(h) c5 (pf) r1 (k ? ) r2 (k ? ) 1.2 22 2 .2 nc 10 10 2.5 22 3.6 nc 25.5 8.06 3.3 22 3.6 20 - 33 115 25.5 5 22 4.7 20 - 39 110 15 table 1 recommended components selection inductor calculating the inductor value is a critical factor in designing a b uck converter. for most designs, the following equation can b e used to calculate the inductor value: sw l in out in out f i v ) v (v v l ? ? ? ? ? where l i is the inductor ripple current and sw f is the buck converter switching frequency. choose the inductor ripple current to be 30% to 50% of th e maximum load current. the maximum inductor peak current is calculated from: 2 i i i l load l(max) ? ? peak current determines the required saturation current rating, which influences the size of the inductor. saturating the inductor decreases the converter efficiency while increasing the temperatures of the inductor and the internal mosfets. hence choosing an inductor with appropriat e saturation current rating is important. a 2.2h to 4.7h inductor with a dc current rating of at lea st 25% percent higher than the maximum load current is rec ommended for most applications. for highest efficiency, the inductors dc resista nce should be less than 100m. use a larger inductance for improved efficiency under light load conditions. input capacitor the input capacitor reduces the surge current drawn fro m the input supply and the switching noise from the device. the input capacitor has to su stain the ripple current produced during the on time on the u pper mosfet. it must have a low esr to minimize the losses. the rms current rating of the input capacitor is a critical parameter that must be higher than the rms input current. as a rule of thumb, select an input capacitor which has rms rating greater than half of the maximum load current. due to large di/dt through the input capacitors, electroly tic or ceramics should be used. if a tantalum must be use d it must be surge protected, otherwise, capacitor failure could occur. for most application s greater than 10f, ceramic capacitor is sufficient. output capacitor the output capacitor keeps the output voltage ripple small, en sures feedback loop stability and reduces the overshoo t of the output voltage. the output capacitor is a basic component for the fast resp onse of the power supply. in fact, during load transient, for the first few microseconds it supplies the current to the load. the converter recogn izes the load transient and sets the duty cycle to maximum, but the current slope is limited by the inductor value. maximum capacitance required can be calculated from the fo llowing equation: esr of the output capacitor dominates the output vol tage ripple. the amount of ripple can be calculated from the eq uation below: esr * i vout inductor ripple ? an output capacitor with large capacitance and low esr is the best option. for most applications, a 22 f to 68f ceramic capacitor will be sufficient. to meet the load transient requirement, co should be greater than the following:
ap65251 document number: ds36109 rev. 1 - 2 11 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 application information (cont.) 2 out 2 out 2 inductor out o v ) v v ( ) 2 i l(i c ? ? ? ? where v is the maximum output voltage overshoot. bootstrap capacitor to ensure the proper operation, a ceramic capacitor must be connected between the vbst and sw pin. a 0.1f ce ramic capacitor is sufficient. pc board layout 1. the ap65 251 works at 2a load current, heat dissipation is a major conce rn in layout the pcb. a 2oz copper in both top and bottom layer is recommended. 2. provide sufficient vias in the thermal exposed pad for heat d issipate to the bottom layer. 3. provide sufficient vias in the output capacitor gnd side to di ssipate heat to the bottom layer. 4. make the bottom layer under the device as gnd layer for heat dissipation. the gnd layer should be as large as possible to p rovide better thermal effect. 5. make the vin capacitors as close to the device as possible . 6. make the vreg5 capacitor as close to the device as poss ible. 1 bst 5 in 4 en 6 sw 3 fb 2 gnd l1 r1 r2 ren cout vout gnd sw vin cin ? input capacitor recommend to be placed as close as possible to device ? wider trace of vin is better for thermal ? add as many gnd via as possible ? the trace connected to inductor and sw is recommended to be wide and short ? keep sensitive signal trace away from sw ? feedback components are recommended to be placed as close as possible to device ? wider trace of gnd is better for thermal ? add as many gnd via as possible
ap65251 document number: ds36109 rev. 1 - 2 12 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 ordering information ap65251 wu - 7 packing package wu : tsot26 7 : tape & reel part number package code part marking identification code tape and reel quantity part number suffix ap65251 wu -7 wu tsot26 sb 3000 -7 marking information t so t26 1 2 3 6 7 4 xx y w x xx : identification code y : year 0~9 x : internal code ( top view ) 5 w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week part number package identification code ap 652 51wu - 7 tsot2 6 sb
ap65251 document number: ds36109 rev. 1 - 2 13 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 package information mechanical data ? surface mount package ? case material: molded plastic, ul flammability classification rating 94v- 0 ? terminals: finish C matte tin plated leads, solderable per mil-std-202, method 208 ? weight: 0.013 grams (approximate) ? max soldering temperature +260c for 30 secs as per jed ec j-std- 020 package view package outline dimensions tsot26 tsot26 dim min max typ a ? 1.00 ? a1 0.010 0.100 ? a2 0.840 0.900 ? d 2.800 3.000 2.900 e 2.800 bsc e1 1.500 1.700 1.600 b 0.300 0.450 ? c 0.120 0.200 ? e 0.950 bsc e1 1.900 bsc l 0.30 0.50 ? l2 0.250 bsc 0 8 4 1 4 12 ? all dimensions in mm suggested pad layout tsot26 dimensions value (in mm) c 0.950 x 0.700 y 1.000 y1 3.199 note: the suggested land pattern dimensions have been provided for refe rence only, as actual pad layouts may vary depending on application. the se dimensions may be modified based on user equipment capability or fabrica tion criteria. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the z dimension. for further informa tion, please reference document ipc -7351a, naming convention for standard smt land patterns, and for international grid details, please see document iec, publication 97. note: for high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distance s between device terminals and pcb tracking. d e1 e1/2 e1 e e/2 e a a2 a1 seating plane 0 l2 l gauge plane 01(4x) 01(4x) c b seating plane y1 c x y top view e3
ap65251 document number: ds36109 rev. 1 - 2 14 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 minimum packing quantity note : package quantities given are for minimum packaging quantity only, n ot minimum order quantity. for minimum order quantity, please contact sales department. note : no mixed date codes or partial quantity (less than minimum packaging q uantity) per packaging is allowed. note : in no case shall there be two or more consecutive components missing fro m any reel for any reason. device tape orientation tape width part number suffix tape orientation 8mm -7 - 13 note : for part marking, refer to product datasheet. note: tape and package drawings are not to scale and are shown for device tape orientation only. quantity tape width part number suffix 7 reel 3,000 8mm -7 13 reel 10,000 8mm - 13 direction of feed
ap65251 document number: ds36109 rev. 1 - 2 15 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 embossed carrier tape specifications tape width (w) dimension value (mm) dimension value (mm) dimension value (mm) 8mm b1 4.5 max. f 3.50.05 p2 2.00.05 d 1.5+0.10 -0.0 k 2.4 max. t 0.40 max. d1 0.35 min. p 4.00.10 w 80.30 e 1.750.10 p0 4.00.10 a0 b0 k0 determined by component size. the clearance between the component and the cavity must comply to the rotational and lateral movement requirement provided in figures in the "maximum component movement in tape pocket section.
ap65251 document number: ds36109 rev. 1 - 2 16 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 embossed carrier tape specifications (continued)
ap65251 document number: ds36109 rev. 1 - 2 17 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 maximum component movement in tape pocket
ap65251 document number: ds36109 rev. 1 - 2 18 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 surface mount reel specifications tape width reel size a (mm) b max (mm) c (mm) d max (mm) n min (mm) g (mm) t max (mm) 8mm 7 178 ? 2 2.0 +0.5 -0 13 +0.5 -0.2 20.5 ? 0.2 55 ? 5 8.4 +1.5 -0.0 14.4 13 330 ? 2 2.0 +0.5 -0 13 +0.5 -0.2 20.5 ? 0.2 100 ? 2 8.4 +1.5 -0.0 14.4 tape leader and trailer specifications note: th ere shall be a leader of at least 230mm which may consist of carrier tape and/or cover tape or a start tape followed by at least 160mm of empty carrier tape sealed with cover tape. note: there shall be a trailer of at least 160mm of empty carrier tape se aled with cover tape. the entire carrier tape must release from t he reel hub as the last portion of the tape unwinds from the reel without damage to th e carrier tape and the remaining components in the cavities.
ap65251 document number: ds36109 rev. 1 - 2 19 of 19 www.diodes.com october 2017 ? diodes incorporated advanced information ap65251 important notice diodes incorporated makes no warranty of any kind, expres s or implied, with regards to this document, including, but not limited to, the implied warranties of me rchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, correct ions or other changes without further notice to this document and any produ ct described herein. diodes incorporated does not assume any liability arising out of the application or use of this document or any product des cribed herein; neither does diodes incorporated convey a ny license under its patent or trademark rights, nor the rights of others. any custom er or user of this document or products described her ein in such applications shall assume all risks of such use and will agree to hold diodes incorpo rated and all the companies whose products are repres ented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any lia bility whatsoever in respect of any products purchased through unauthorized sales channel. should customers purchase or use diodes incorporated prod ucts for any unintended or unauthorized application, cus tomers shall indemnify and hold diodes incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. p roduct names and markings noted herein may also be covered by one or more unite d states, international or foreign trademarks. this document is written in english but may be translated int o multiple languages for reference. only the english version o f this document is the final and determinative format released by diodes incorporat ed. life support diodes incorporated products are specifically not auth orized for use as critical components in life support dev ices or systems without the express written approval of the chief executive officer of diodes i ncorporated. as used herein: a. life support devices or systems are devices or sy stems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perfor m when properly used in accordance with instructions for u se provided in the labeling can be reasonably expected to result in signi ficant injury to the user. b. a critical component is any component in a life sup port device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect i ts safety or effectiveness. customers represent that they have all necessary exp ertise in the safety and regulatory ramifications of their lif e support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concern ing their products and any use of diodes incorporated products in such safety-criti cal, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by diodes incor porated. further, customers must fully indemnify diodes incorp orated and its representatives against any damages arising out of the u se of diodes incorporated products in such safety-critic al, life support devices or systems. copyright ? 2017, diodes incorporated www.diodes.com

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